With ever-increasing miniaturization, the semiconductor plating industry is providing advanced IC packages to develop next-generation chip designs. To keep pace with technological improvements, pump systems must keep process precious plating solutions controlled, uniform, and with no particle generation. Compared to Levitronix® pumps, magdrive centrifugal pumps contain mechanical slide bearings, which clog and fail due to the solution’s precipitation. Levitronix® pump systems are based on active magnetic levitation, which results in a significantly extended equipment uptime and a reliable, pulsation-free, and consistent flow. The absence of a mechanical bearing ensures virtually no particle generation.
By eliminating a mechanical bearing, no mechanical friction occurs that could cause local hotspots. No narrow gaps exist where metal could precipitate. The low-shear, dead-zone-free pump design, and the smooth, wetted plastic surfaces further help avoid metal deposition in the pump, resulting in an increased lifetime.
Levitronix® pump systems are based on active magnetic levitation. There is no mechanical coupling between the impeller and the pump head casing, which leads to wear-free operation and, therefore, virtually no particle generation.
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Application Brochure: Increased Uniformity and Yield in Metal Plating 
