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Particle Agglomeration Mechanism in CMP Slurries

Some CMP slurries used for wafer polishing can be damaged during handling. The damage results in agglomerated particles that can cause defects during wafer polishing. This testwork was part of a study to determine if slurry damage is the result of shear, as is commonly believed, or alternatively, cavitation. The data suggest that cavitation may play a more significant role in agglomeration of slurry particles than shear and that slurry handling equipment design should focus on eliminating liquid cavitation rather than controlling shear.

Author Marc R. Litchy et. al.
Company CT Associates, Inc. et. al.
Pages 8