Media Center

Back to Media Center

How Pump-Induced Particles Affect Low-k CMP Defectivity

High shear flow generated by positive displacement pumps increases the distribution of oversized particles, leading to significantly increased wafer surface defectivity (scratches or roughness) during CMP, whereas less defectivity was found in slurries circulated by a magnetically levitated (maglev) centrifugal pump.

Author F.C. Chang et. al.
Company University of Florida
Pages 5