Wafer dicing has always been a critical step in semiconductor manufacturing. Today, it has become more important than ever, particularly with the emergence of advanced packaging technologies such as 2.5D and 3D integration, where clean and damage-free dies are essential for downstream processes. Conventional dicing methods, including blade sawing and laser dicing, often generate significant debris and can introduce damage to the die surface and edges. To mitigate these effects, protective photoresist layers are commonly applied prior to dicing. However, after singulation, these layers must be completely removed to expose the underlying structures for further processing. This presents an additional challenge, as diced wafers remain mounted on tape frames, making handling and cleaning more complex.

Siconnex addresses these challenges with its BatchSpray technology, offering an integrated and automated solution. The system enables safe and efficient handling of tape frames, allowing the wafer to be processed directly within the process chamber without the need for manual intervention. Cleaning is performed using the SicOzone process, which effectively removes dicing residues while simultaneously stripping the photoresist layer. The result is a clean, residue-free die, ready for subsequent manufacturing steps.

In the context of advanced packaging, plasma dicing—particularly using the BOSCH process—introduces an additional challenge, as polymer residues can form on the sidewalls of the dies. These residues may detach during later processing, potentially leading to contamination and defects. Siconnex addresses this issue by combining its ozone-based cleaning approach with a percTM (Post-Etch Residue Clean) process, enabling efficient removal of these polymer deposits.

Overall, Siconnex’s BatchSpray technology provides a compact, flexible, and process-adaptable solution that meets the evolving requirements of modern semiconductor manufacturing.