Microelectronics > Surface Preparation

Surface Preparation

As soon as wafers are introduced to a cleanroom, or after they have completed a process step, these wafers undergo a cleaning procedure to remove particles and contamination. Surface preparation systems use one of several methods to eliminate particles, such as brushes or sprays, depending on the type of cleaning required.

As the IC industry moves towards 300mm manufacturing, single-wafer processing for surface preparation steps shows benefits over the traditional wet bench processes. Amongst these benefits, better within-wafer uniformity, better wafer-to-wafer repeatability, tighter process control or shorter process times were already demonstrated.

In order to compete with Batch-Processing however, ultimate low particle generation and continuous flow requirements are required and define process yields. Also component footprint-/ and lifetime are crucial cost drivers for the complex designed tools.

Single Wafer Preparation - A Levitronix high purity dynamic flow control system with fast response time contributes to a wide process window. Accurate, repeatable and therefore reliable processing is guaranteed. Source SPS

On-Line Mixing of Chemicals

Data by CT Associates, Inc.

Size Comparison LEVITRONIX vs. Diaphragm Pump

LEVITRONIX pump (black line) create significant fewer particles than other state-of-the art pumps and therefore will help to decrease particle defect on the wafer.

Also the compact design and the high reliability of LEVITRONIX pumps will allow alternative design options and therefore reduce costs related to footprint.

Due to the highly accurate continues flow and pressure capabilities and the electronic control functions, LEVITRONIX pump systems can be ideally facilitated as dynamic flow controller for online blending purposes.