PLATING - ELECTRO CHEMICAL DEPOSITION (ECD)
Plating or ECD Electro-Chemical Deposition is a wet chemistry process. Primarily it is used to build the metal primary conductive wires in advanced integrated circuits where the different functional layers are connected with each other. Electrochemical deposition uses an electrolytic solution which creates lines and vias in layer which has been etched with a predefined pattern of the circuit. The process has a wide range of application in the Microelectronic Industry as
- Gold ECD (bonding pads, interconnects)
- Copper Damascene and Patterned Copper ECD
- Permalloy ECD (GMR heads)
- Solder ECD (bumping)
Wafer Plating
Uniformity and undefined outplating is of great concern to the plating process on silicon wafers. It is important that the over plating is kept to a minimum, as the CMP process following the metal deposition is very cost intensive.
Consistent Flow - LEVITRONIX Centrifugal Pump
LEVITRONIX pump systems provide a very consistent electrolyte flow which is one of the key drivers for the plating uniformity. By doing so, the plating process can be controlled in a very narrow process window and costly overplating can be reduced or eliminated.
Also undesired outplating effects are eliminated due to LEVITRONIX'S "Big Gap" design and specifically suited materials of construction. Details please find in our "Learn More" section.
Highly Fluctuating Flow - Diaphragm Pump
Pulsing Flow - Bellows Pump
Due to the highly accurate continues flow and pressure capabilities combined with electronic control functions, LEVITRONIX pump systems can be ideally facilitated as consistent pressure source or dynamically as flow controller for uniform plating purposes.
- No Pulsation, Improved Process Control
- Very Low Particle Generation
- No Polymer Particles
- Integrated Flow Control Software
- Integrated Filter Condition Monitoring
