Levitronix CMP Users Conference 2007 | English |
"Keynote address: Notable Trends in CMP: Past, Present and Future"
Peter Singer, Semiconductor International Magazine
|  3001 kB |
"Solution Chemistry Effects on Cracking and Damage during CMP"
Reinhold H. Dauskardt, Dpt. of Materials Science and Engineering, Stanford University
| 808 kB |
"Controlling CMP related defects via slurry and Post CMP chemistry designs"
Deepak Mahulikar, Planar Solutions LLC, A Fujifilm Wacker JV
| 1030 kB |
"Surface mediated particle-particle aggregation during CMP slurry delivery and handling."
Yuzhuo Li, Clarkson University
| 1205 kB |
"Field Evaluation of High Pressure MagLev Pump in CMP Slurry Recirculation"
David Gerken, BOC Edwards
| 469 kB |
"Pump Induced Slurry Stress Effects During CMP of Metals and Dielectrics"
Rajiv Singh, Particle Engineering Research Center, U. of Florida
| 1330 kB |
"Effect of pump type on the health of various CMP slurries"
Mark Litchy, CT Associates, Inc.
| 310 kB |
"Practical Application of Bulk Slurry Metrology"
Brian Orzechowski, Celerity
| 416 kB |
"Investigation of Valve Effects on Wafer Defectivity using an Oxide Slurry"
Budge Johl and Hethel Porter
| 558 kB |
"Investigations of Nanoparticle Abrasive Retention in Polyurethane CMP Pads post- Cu CMP"
Christopher L. Borst, Iftikhar Ul-hasan, Robert E. Geer
| 2326 kB |
"Post CMP Defects; Their Origin and Removal"
Jin-Goo Park, Div. of Materials and Chemical Engineering Hanyang University, Korea
| 3184 kB |
"Stabilization of pH in Oxide Slurry"
Bob Small, Silco
| 130 kB |
"Efficient Flow Control and Filtration in CMP Slurry Distribution"
Rakesh Singh, Entegris
| 182 kB |
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